FM205-MST

Features

• Well package design with solder pad on the bottom for

  best thermal performance

• Low profile package 0.95 mm ( typ.)

• Tiny plastic SMD package

• Glass passivated chip junction

• Ideal for automated placement

• High current capability

• High surge capability

• Lead free parts meet RoHS requirements

• Suffix "-H" indicates Halogen-free parts, ex. FΜ201-ΜSΤ-H

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123ST / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

   Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.0155 gram