FFM103-M

Features

• Batch process design, excellent power dissipation offers 

   better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

   optimize board space.

• Tiny plastic SMD package.

• High current capability.

• Fast switching for high efficiency.

• High surge current capability.

• Glass passivated chip junction.

• Lead-free parts meet RoHS requirments.

• Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H.

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123 / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750, 

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.018 gram