SFM13

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Low profile surface mounted application in order to

   optimize board space

• High current capability

• Superfast recovery time for switching mode application

• High surge current capability

• Glass passivated chip junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. SFM11-H

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SMA

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.05 gram