SFM11-M

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Tiny plastic SMD package

• High current capability

• Superfast recovery time for switching mode application

• High surge current capability

• Glass passivated chip junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. SFM11-M-H

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123 / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.018 gram