EGFM303

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

   optimize board space

• High current & surge capability

• Low forward dropdown voltage

• Glass passivated chip junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. EGFM301-H

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SMC

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.19 gram