EGFM101-M

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Low profile surface mounted application in order to

   optimize board space

• High current & surge capability

• Low forward dropdown voltage

• Glass passivated chip junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. EGFM101-M-H

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123 / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.018 gram