FM560

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Low profile surface mounted application in order to

   optimize board space

• Low power loss, high efficiency

• High current capability, low forward voltage drop

• High surge capability

• Guardring for overvoltage protection

• Ultra high-speed switching

• Silicon epitaxial planar chip, metal silicon junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen-free parts, ex. FΜ520-H

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SMC

• Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.19 gram