FM360-MST

Features

• Well package design with solder pad on the bottom for

   best thermal performance

• Low profile surface mounted application in order to

   optimize board space

• Tiny plastic SMD package

• Low power loss, high efficiency

• High current capability, low forward voltage drop

• High surge capability

• Silicon epitaxial planar chip, metal silicon junction

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. FM340-ΜSΤ-H

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123ST / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

                   Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.0155 gram