FM2150

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

   optimize board space.

• Low power loss, high efficiency.

• High current capability, low forward voltage drop.

• High surge capability.

• Guardring for overvoltage protection

• Ultra high-speed switching.

• Silicon epitaxial planar chip, metal silicon junction.

• Lead-free parts meet environmental standards of

   MIL-STD-19500 /228

• Suffix "-H" indicates Halogen-free parts, ex. FM220-H.

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic,DO-214AC / SMA

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight :Approximated 0.05 gram