LFM240-HST

Features

• Batch process design, excellent power dissipation offers

  better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

  optimize board space.

• Low leakage current.

• High current capability, very low forward voltage drop.

• High surge capability.

• Guardring for overvoltage protection.

• Ultra high-speed switching.

• Silicon epitaxial planar chip, metal silicon junction.

• Lead-free parts meet environmental standards of

  MIL-STD-19500 /228

• Suffix "-H" indicates Halogen free parts, ex. LFM220-ΗSΤ-H.

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic,SMA-HST

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.037 gram