LFM240

Features

• Batch process design, excellent power dissipation offers

  better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

  optimize board space.

• Low power loss, high efficiency.

• High current capability, low forward voltage drop.

• High surge capability.

• Guardring for overvoltage protection.

• Ultra high-speed switching.

• Silicon epitaxial planar chip, metal silicon junction.

• Lead-free parts meet environmental standards of

  MIL-STD-19500 /228

• Suffix "-H" indicates Halogen-free parts, ex. LFM220-H.

Mechanical data

Epoxy:UL94-V0 rated flame retardant

Case : Molded plastic,DO-214AC / SMA

Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : Approximated 0.05 gram