LFM140-M

Features

• Batch process design, excellent power dissipation offers

  better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to

  optimize board space.

• Tiny plastic SMD package.

• Low power loss, high efficiency.

• High current capability, low forward voltage drop.

• High surge capability.

• Guardring for overvoltage protection.

• Ultra high-speed switching.

• Silicon epitaxial planar chip, metal silicon junction.

• Lead-free parts meet environmental standards of 

   MIL-STD-19500 /2208

• Suffix "-H" indicates Halogen free parts, ex. LFM120-M-H.

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123 / MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750, 

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.018 gram