BZX55C47

 Features

• Silicon epitaxial planar chip structure

• Glass hermetically sealed package

• Wide zener reverse voltage range 2.0V to 100V

• V tolerance selection of ±5% Z

• Small package size for high density applications

• Ideally suited for automated assembly processes

• Lead-free parts meet RoHS requirements

Mechanical data

• Case : Glass, DO-35G

• Terminals :Plated terminals, solderable per MIL-STD-750,

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.125 gram