ZGFM3033B

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Glass passivated chip junction

• Standard zener voltage tolerance 5% ±

• Low inductance

• Low profile package

• Built-in strain relief

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen-free part, ex.ZGFM305V6B-H

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SMB

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.09 gram