ZS170B

Features

• Batch process design, excellent power dissipation offers

   better reverse leakage current and thermal resistance

• Glass passivated chip junction

• Standard zener voltage tolerance ±5% 

• Low inductance

• Low profile package

• Built-in strain relief

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen-free part, ex.ZS100B-H

Mechanical data

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic,SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.05 gram