MMSZ5226B

Features

• Up to 500mW power dissipation

• Silicon epitaxial planar chip structure

• Wide zener voltage range selection, 2.4V to 75V

• Small package size for high density applications

• Ideally suited for automated assembly processes

• Lead-free parts meet RoHS requirements

• Suffix "-H" indicates Halogen free parts, ex. MMSZ5221B-H

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123F

• Terminals : Solder plated, solderable per

                     MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.010 gram