ZMM5225B

Features

• Silicon epitaxial planar chip structure.

• Wide zener reverse voltage range 2.4V to 75V.

• Small package size for high density applications.

• Glass hermetically sealed package. 

• Ideally suited for automated assembly processes.

• Lead-free parts meet environmental standards of 

   MIL-STD-19500 /228

Mechanical data

• Case : Glass Mini-Melf / SOD-80

• Terminals :Plated terminals, solderable per MIL-STD-750, 

                    Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.03 gram